The effects of electrodeposition conditions on the cycle performance of Sn electrodes were investigated in this study. Sn electrodes were electrodeposited on Cu substrates under different conditions, such as the electrodeposition baths and the current densities to maximize cycle performance and coulombic efficiency. By using different types of electrodeposition baths, Sn electrodes with different phases were electrodeposited. The formation of an eta-Cu(6)Sn(5) phase between the Sn layer and Cu substrate contributes to the improvement of the cycle performance of the Sn electrode. As the current density increased, the Sn layers became less dense structure with nodule-type morphology. The less dense Sn electrodes with nodule-type morphology exhibited a better cycle performance due to the absence of the high-voltage irreversible reaction and their buffering effects for volume expansion.