Special Section on Through Silicon Vias Foreword
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kam, Dong Gun | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2013-03-09T08:48:37Z | - |
| dc.date.available | 2013-03-09T08:48:37Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-02 | - |
| dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.152 - 153 | - |
| dc.identifier.issn | 2156-3950 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/95912 | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Special Section on Through Silicon Vias Foreword | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000292779200001 | - |
| dc.identifier.scopusid | 2-s2.0-84876911057 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 1 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 152 | - |
| dc.citation.endingpage | 153 | - |
| dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kam, Dong Gun | - |
| dc.type.journalArticle | Editorial Material | - |
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