DC Field | Value | Language |
---|---|---|
dc.contributor.author | Seo, Sun-Kyoung | ko |
dc.contributor.author | Kang, Sung K. | ko |
dc.contributor.author | Cho, Moon Gi | ko |
dc.contributor.author | Lee, HyuckMo | ko |
dc.date.accessioned | 2013-03-09T04:09:16Z | - |
dc.date.available | 2013-03-09T04:09:16Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-07 | - |
dc.identifier.citation | JOM, v.62, no.7, pp.22 - 29 | - |
dc.identifier.issn | 1047-4838 | - |
dc.identifier.uri | http://hdl.handle.net/10203/95319 | - |
dc.description.abstract | The electromigration (EM) performance of Pb-free solder joints is investigated in terms of solder composition (Sn-0.5Cu vs. Sn-1.8Ag) and joining path to Cu vs. Ni(P) under bump metallization (UBM). In the double-sided joints of Ni(P)/solder/Cu, the microstructure of solder joints and the interfacial intermetallic compound (IMC) layers are significantly affected by solder composition and joining path. The as-reflowed microstructure of Sn-0.5Cu joints consists of small columnar grains with thin IMC layers at both UBM interfaces, independent of the joining path, while Sn-1.8Ag joints have a few large grains of low-angle grain boundaries with thick IMC layers when joined first to Ni(P) UBM, but a few 60 degrees twins with thin IMC layers when joined first to Cu UBM. The EM stressing under high current densities at 150 degrees C reveals that Sn-1.8Ag joints have a superior lifetime compared to Sn-0.5Cu joints. In addition, the EM lifetime of Sn-1.8Ag joints reflowed first on Ni(P) UBM is the longest among four groups of the solder joints examined. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | INTERFACIAL REACTIONS | - |
dc.subject | SN-3.5AG SOLDER | - |
dc.subject | SN-CU | - |
dc.subject | TIN | - |
dc.subject | DIFFUSION | - |
dc.title | Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path | - |
dc.type | Article | - |
dc.identifier.wosid | 000279875600005 | - |
dc.identifier.scopusid | 2-s2.0-77956944829 | - |
dc.type.rims | ART | - |
dc.citation.volume | 62 | - |
dc.citation.issue | 7 | - |
dc.citation.beginningpage | 22 | - |
dc.citation.endingpage | 29 | - |
dc.citation.publicationname | JOM | - |
dc.contributor.localauthor | Lee, HyuckMo | - |
dc.contributor.nonIdAuthor | Seo, Sun-Kyoung | - |
dc.contributor.nonIdAuthor | Kang, Sung K. | - |
dc.contributor.nonIdAuthor | Cho, Moon Gi | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | INTERFACIAL REACTIONS | - |
dc.subject.keywordPlus | SN-3.5AG SOLDER | - |
dc.subject.keywordPlus | SN-CU | - |
dc.subject.keywordPlus | TIN | - |
dc.subject.keywordPlus | DIFFUSION | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.