Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects

Cited 13 time in webofscience Cited 0 time in scopus
  • Hit : 556
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorCho, Jeonghyeonko
dc.contributor.authorSong, Eak-Hwanko
dc.contributor.authorKim, Hee-Gonko
dc.contributor.authorAhn, Seung-Youngko
dc.contributor.authorPak, Jun-Soko
dc.contributor.authorKim, Ji-Seongko
dc.contributor.authorKim, Joung-Hoko
dc.date.accessioned2013-03-09T02:16:22Z-
dc.date.available2013-03-09T02:16:22Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-08-
dc.identifier.citationIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.53, no.3, pp.814 - 822-
dc.identifier.issn0018-9375-
dc.identifier.urihttp://hdl.handle.net/10203/95098-
dc.description.abstractThe mixed-mode ABCD parameters are newly introduced and developed, where the definition and the connection are carefully established to have both the advantages of the mixed-mode S-parameters and the ABCD parameters, simultaneously. In addition, closed-form equations to model symmetric and asymmetric coupled transmission lines are derived. With the derived equations, the voltage transfer functions and the eye diagram of a variety of printed circuit board (PCB)-level differential interconnects are analytically attainable, which greatly enhances their applicability for signal integrity analysis. To verify the derived equations and to validate the proposed mixed-mode ABCD parameters, a series of microstrip-type differential lines on PCB test vehicles were fabricated and tested. The effectiveness of the proposed mixed-mode ABCD parameters was successfully confirmed through the comparison studies, in particular for the case of mode-conversion occurrence at the differential lines.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectCOUPLED TRANSMISSION-LINES-
dc.subjectSCATTERING PARAMETERS-
dc.titleMixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects-
dc.typeArticle-
dc.identifier.wosid000294131700030-
dc.identifier.scopusid2-s2.0-80052055602-
dc.type.rimsART-
dc.citation.volume53-
dc.citation.issue3-
dc.citation.beginningpage814-
dc.citation.endingpage822-
dc.citation.publicationnameIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY-
dc.contributor.localauthorAhn, Seung-Young-
dc.contributor.localauthorKim, Joung-Ho-
dc.contributor.nonIdAuthorSong, Eak-Hwan-
dc.contributor.nonIdAuthorKim, Hee-Gon-
dc.contributor.nonIdAuthorPak, Jun-So-
dc.contributor.nonIdAuthorKim, Ji-Seong-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorDifferential interconnect-
dc.subject.keywordAuthoreye diagram-
dc.subject.keywordAuthormixed-mode ABCD parameters-
dc.subject.keywordAuthorprinted circuit board (PCB)-
dc.subject.keywordAuthorsignal integrity-
dc.subject.keywordAuthortransfer function-
dc.subject.keywordPlusCOUPLED TRANSMISSION-LINES-
dc.subject.keywordPlusSCATTERING PARAMETERS-
Appears in Collection
GT-Journal Papers(저널논문)EE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 13 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0