Copper Seed Layer Deposition by a New Liquid Precursor

Abstract

Cu(hfac)(2)(TEA) (hfac 1,1,1,5,5,5-hexafluoroacetylacetonate, TEA (triethylamine, N(C(2)H(5))(3))) is a new liquid Cu(II) precursor. Using Cu(hfac)(2)(TEA), we successfully deposit Cu thin films as a seed layer, even at the low deposition temperature of 373 K. To explain this behavior, the bonding status of Cu(hfac)(2) in the presence of TEA is determined by density-functional theory. The theoretical bond length of Cu-O in Cu(hfac)(2) is significantly greater (by 0.06 angstrom) than that without an adduct ligand.