Thermal issues in 3D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 신인섭 | ko |
| dc.contributor.author | 김상민 | ko |
| dc.contributor.author | 백승훈 | ko |
| dc.contributor.author | 서문준 | ko |
| dc.contributor.author | 유리은 | ko |
| dc.contributor.author | 신영수 | ko |
| dc.date.accessioned | 2013-03-08T17:33:29Z | - |
| dc.date.available | 2013-03-08T17:33:29Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-09 | - |
| dc.identifier.citation | 전자공학회지, v.36, no.9, pp.980 - 990 | - |
| dc.identifier.issn | 1016-135X | - |
| dc.identifier.uri | http://hdl.handle.net/10203/93764 | - |
| dc.language | Korean | - |
| dc.publisher | 대한전자공학회 | - |
| dc.title | Thermal issues in 3D IC | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 36 | - |
| dc.citation.issue | 9 | - |
| dc.citation.beginningpage | 980 | - |
| dc.citation.endingpage | 990 | - |
| dc.citation.publicationname | 전자공학회지 | - |
| dc.contributor.localauthor | 신영수 | - |
| dc.contributor.nonIdAuthor | 신인섭 | - |
| dc.contributor.nonIdAuthor | 김상민 | - |
| dc.contributor.nonIdAuthor | 백승훈 | - |
| dc.contributor.nonIdAuthor | 서문준 | - |
| dc.contributor.nonIdAuthor | 유리은 | - |
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