DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, K. H. | ko |
dc.contributor.author | Yu, Jin | ko |
dc.contributor.author | Kim, J. H. | ko |
dc.date.accessioned | 2013-03-08T15:03:36Z | - |
dc.date.available | 2013-03-08T15:03:36Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-09 | - |
dc.identifier.citation | SCRIPTA MATERIALIA, v.63, no.5, pp.508 - 511 | - |
dc.identifier.issn | 1359-6462 | - |
dc.identifier.uri | http://hdl.handle.net/10203/93345 | - |
dc.description.abstract | The "black pad" phenomenon, which rarely occurs in electrolessly plated nickel phosphorous (Ni-P) films, was reproduced This work reports that nodular variation of the P content induces potential differences large enough to drive galvanic corrosion when the film is exposed to an electrolyte containing gold cyanide. Subsequent corrosion couple experiments using films with different P contents demonstrated that preferential corrosion occurred at the low P side, and the propensity of forming black pad increased with the difference in P content (Delta P) (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | PCB FINAL FINISHES | - |
dc.subject | SOLDER JOINTS | - |
dc.title | A corrosion couple experiment reproducing the black pad phenomenon found after the electroless nickel immersion gold process | - |
dc.type | Article | - |
dc.identifier.wosid | 000280048400013 | - |
dc.identifier.scopusid | 2-s2.0-77953684802 | - |
dc.type.rims | ART | - |
dc.citation.volume | 63 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 508 | - |
dc.citation.endingpage | 511 | - |
dc.citation.publicationname | SCRIPTA MATERIALIA | - |
dc.identifier.doi | 10.1016/j.scriptamat.2010.05.015 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Kim, K. H. | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Corrosion | - |
dc.subject.keywordAuthor | Galvanization | - |
dc.subject.keywordAuthor | Interface defects | - |
dc.subject.keywordAuthor | Black pad | - |
dc.subject.keywordPlus | PCB FINAL FINISHES | - |
dc.subject.keywordPlus | SOLDER JOINTS | - |
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