DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, JY | ko |
dc.contributor.author | Son, HJ | ko |
dc.contributor.author | Byun, YH | ko |
dc.contributor.author | Lee, SY | ko |
dc.contributor.author | Hwang, EC | ko |
dc.contributor.author | Song, KY | ko |
dc.contributor.author | Noh, CH | ko |
dc.contributor.author | Kim, Jin-Baek | ko |
dc.date.accessioned | 2013-03-07T18:40:15Z | - |
dc.date.available | 2013-03-07T18:40:15Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-02 | - |
dc.identifier.citation | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS, v.44, no.2, pp.865 - 868 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10203/90965 | - |
dc.description.abstract | We report a simple method for realizing the direct lithographic patterning of metallic silver and its alloy from amorphous films of photosensitive silver organometallic compounds. In this process, ultraviolet (UV) light was used to selectively activate organometallic compounds, converting organometallic compounds to metallic states in illuminated regions. The photolysis process was monitored by FTIR spectroscopy and the products were analyzed by UV-visible light spectrometry, X-ray photoelectron spectroscopy (XPS), and X-ray diffraction analysis (XRD). A feature size of 5 mu m was demonstrated through the process. | - |
dc.language | English | - |
dc.publisher | JAPAN SOC APPLIED PHYSICS | - |
dc.subject | THIN-FILMS | - |
dc.subject | TITANIUM-NITRIDE | - |
dc.subject | AG FILMS | - |
dc.subject | ENCAPSULATION | - |
dc.subject | LITHOGRAPHY | - |
dc.subject | ADHESION | - |
dc.subject | AMBIENT | - |
dc.subject | COPPER | - |
dc.title | Microseale metal patterning using photosensitive silver organometallic compounds | - |
dc.type | Article | - |
dc.identifier.wosid | 000227675300015 | - |
dc.identifier.scopusid | 2-s2.0-17444384231 | - |
dc.type.rims | ART | - |
dc.citation.volume | 44 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 865 | - |
dc.citation.endingpage | 868 | - |
dc.citation.publicationname | JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS | - |
dc.identifier.doi | 10.1143/JJAP.44.865 | - |
dc.contributor.localauthor | Kim, Jin-Baek | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Son, HJ | - |
dc.contributor.nonIdAuthor | Byun, YH | - |
dc.contributor.nonIdAuthor | Lee, SY | - |
dc.contributor.nonIdAuthor | Hwang, EC | - |
dc.contributor.nonIdAuthor | Song, KY | - |
dc.contributor.nonIdAuthor | Noh, CH | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | silver films | - |
dc.subject.keywordAuthor | direct patterning | - |
dc.subject.keywordAuthor | photometallization | - |
dc.subject.keywordAuthor | organometallic compounds | - |
dc.subject.keywordPlus | THIN-FILMS | - |
dc.subject.keywordPlus | TITANIUM-NITRIDE | - |
dc.subject.keywordPlus | AG FILMS | - |
dc.subject.keywordPlus | ENCAPSULATION | - |
dc.subject.keywordPlus | LITHOGRAPHY | - |
dc.subject.keywordPlus | ADHESION | - |
dc.subject.keywordPlus | AMBIENT | - |
dc.subject.keywordPlus | COPPER | - |
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