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College of Natural Sciences(자연과학대학)Dept. of Chemistry(화학과)CH-Journal Papers(저널논문)

Microseale metal patterning using photosensitive silver organometallic compounds

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dc.contributor.authorKim, JYko
dc.contributor.authorSon, HJko
dc.contributor.authorByun, YHko
dc.contributor.authorLee, SYko
dc.contributor.authorHwang, ECko
dc.contributor.authorSong, KYko
dc.contributor.authorNoh, CHko
dc.contributor.authorKim, Jin-Baekko
dc.date.accessioned2013-03-07T18:40:15Z-
dc.date.available2013-03-07T18:40:15Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2005-02-
dc.identifier.citationJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS, v.44, no.2, pp.865 - 868-
dc.identifier.issn0021-4922-
dc.identifier.urihttp://hdl.handle.net/10203/90965-
dc.description.abstractWe report a simple method for realizing the direct lithographic patterning of metallic silver and its alloy from amorphous films of photosensitive silver organometallic compounds. In this process, ultraviolet (UV) light was used to selectively activate organometallic compounds, converting organometallic compounds to metallic states in illuminated regions. The photolysis process was monitored by FTIR spectroscopy and the products were analyzed by UV-visible light spectrometry, X-ray photoelectron spectroscopy (XPS), and X-ray diffraction analysis (XRD). A feature size of 5 mu m was demonstrated through the process.-
dc.languageEnglish-
dc.publisherJAPAN SOC APPLIED PHYSICS-
dc.subjectTHIN-FILMS-
dc.subjectTITANIUM-NITRIDE-
dc.subjectAG FILMS-
dc.subjectENCAPSULATION-
dc.subjectLITHOGRAPHY-
dc.subjectADHESION-
dc.subjectAMBIENT-
dc.subjectCOPPER-
dc.titleMicroseale metal patterning using photosensitive silver organometallic compounds-
dc.typeArticle-
dc.identifier.wosid000227675300015-
dc.identifier.scopusid2-s2.0-17444384231-
dc.type.rimsART-
dc.citation.volume44-
dc.citation.issue2-
dc.citation.beginningpage865-
dc.citation.endingpage868-
dc.citation.publicationnameJAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS-
dc.identifier.doi10.1143/JJAP.44.865-
dc.contributor.localauthorKim, Jin-Baek-
dc.contributor.nonIdAuthorKim, JY-
dc.contributor.nonIdAuthorSon, HJ-
dc.contributor.nonIdAuthorByun, YH-
dc.contributor.nonIdAuthorLee, SY-
dc.contributor.nonIdAuthorHwang, EC-
dc.contributor.nonIdAuthorSong, KY-
dc.contributor.nonIdAuthorNoh, CH-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorsilver films-
dc.subject.keywordAuthordirect patterning-
dc.subject.keywordAuthorphotometallization-
dc.subject.keywordAuthororganometallic compounds-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusTITANIUM-NITRIDE-
dc.subject.keywordPlusAG FILMS-
dc.subject.keywordPlusENCAPSULATION-
dc.subject.keywordPlusLITHOGRAPHY-
dc.subject.keywordPlusADHESION-
dc.subject.keywordPlusAMBIENT-
dc.subject.keywordPlusCOPPER-
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CH-Journal Papers(저널논문)
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