Structural health monitoring using electro-mechanical impedance sensors

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dc.contributor.authorPark, Sko
dc.contributor.authorYun, Chung Bangko
dc.contributor.authorInman, DJko
dc.date.accessioned2013-03-07T17:25:04Z-
dc.date.available2013-03-07T17:25:04Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-08-
dc.identifier.citationFATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES, v.31, no.8, pp.714 - 724-
dc.identifier.issn8756-758X-
dc.identifier.urihttp://hdl.handle.net/10203/90774-
dc.description.abstractThis paper reports recent achievements of novel structural health monitoring (SHM) techniques for damage diagnosis for critical members of civil, mechanical and aerospace structures using electro-mechanical impedance sensors. The basic concept of this technique is to use simultaneously both high-frequency structural excitations and responses employing piezoelectric sensors to monitor the local area of a structure for changes in structural impedance that would indicate imminent damage. In this paper, several principal software and hardware issues on these topics are described. A new impedance model is proposed that incorporates the effects of sensor and bonding defects for sensor self-diagnosis. Temperature effects-free impedance-based damage detection algorithm using effective frequency shifts based on cross-correlation coefficients is presented. In a sense of tailoring wireless sensing technology to the impedance methods, an active sensor node incorporating a miniaturized impedance sensing device, an on-board microcontroller, and a radio frequency (RF) telemetry is introduced. A data compression algorithm is embedded into the on-board chip of the active sensor node to enhance its local data processing-capability. Finally, this paper concludes with a discussion of further studies and future applications.-
dc.languageEnglish-
dc.publisherWILEY-BLACKWELL-
dc.subjectMATERIAL SYSTEMS-
dc.subjectACTUATOR-
dc.subjectTEMPERATURE-
dc.subjectELEMENT-
dc.subjectPATCHES-
dc.subjectMODEL-
dc.titleStructural health monitoring using electro-mechanical impedance sensors-
dc.typeArticle-
dc.identifier.wosid000259907400009-
dc.identifier.scopusid2-s2.0-54249119701-
dc.type.rimsART-
dc.citation.volume31-
dc.citation.issue8-
dc.citation.beginningpage714-
dc.citation.endingpage724-
dc.citation.publicationnameFATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES-
dc.identifier.doi10.1111/j.1460-2695.2008.01248.x-
dc.contributor.localauthorYun, Chung Bang-
dc.contributor.nonIdAuthorInman, DJ-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorelectro-mechanical impedance-
dc.subject.keywordAuthorpiezoelectric sensors-
dc.subject.keywordAuthorsensor diagnosis-
dc.subject.keywordAuthorsensor nodes-
dc.subject.keywordAuthorstructural health monitoring-
dc.subject.keywordAuthortemperature effects-
dc.subject.keywordPlusMATERIAL SYSTEMS-
dc.subject.keywordPlusACTUATOR-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusELEMENT-
dc.subject.keywordPlusPATCHES-
dc.subject.keywordPlusMODEL-
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