DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nakayama, Wataru | ko |
dc.contributor.author | Kim, SungJin | ko |
dc.date.accessioned | 2013-03-07T16:59:06Z | - |
dc.date.available | 2013-03-07T16:59:06Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008 | - |
dc.identifier.citation | HEAT TRANSFER ENGINEERING, v.29, no.2, pp.117 - 119 | - |
dc.identifier.issn | 0145-7632 | - |
dc.identifier.uri | http://hdl.handle.net/10203/90733 | - |
dc.description.abstract | Heat transfer engineering is an indispensable discipline among those that support the rapid progress of electronics technology. Through applications to cooling design, the basic knowledge and the methodology of heat transfer engineering have contributed to the evolution of high-performance and reliable electronic equipment. The relationship between the technology and its building block disciplines, however, is not unilateral. Demands for higher performance and more diverse functions on electronic equipment have stimulated the growth of new research topics and methodologies of heat transfer engineering. | - |
dc.language | English | - |
dc.publisher | TAYLOR FRANCIS INC | - |
dc.title | Recent topics in electronics cooling - From transistors to systems | - |
dc.type | Article | - |
dc.identifier.wosid | 000252456400001 | - |
dc.identifier.scopusid | 2-s2.0-38349155177 | - |
dc.type.rims | ART | - |
dc.citation.volume | 29 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 117 | - |
dc.citation.endingpage | 119 | - |
dc.citation.publicationname | HEAT TRANSFER ENGINEERING | - |
dc.contributor.localauthor | Kim, SungJin | - |
dc.contributor.nonIdAuthor | Nakayama, Wataru | - |
dc.type.journalArticle | Editorial Material | - |
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