A very compact 62-GHz transmitter LTCC SiP module for wireless terminals applications

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dc.contributor.authorLee, YCko
dc.contributor.authorPark, Chul Soonko
dc.date.accessioned2013-03-07T10:43:41Z-
dc.date.available2013-03-07T10:43:41Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-03-
dc.identifier.citationMICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.49, pp.575 - 578-
dc.identifier.issn0895-2477-
dc.identifier.urihttp://hdl.handle.net/10203/89987-
dc.description.abstractA 10 X 21 X I nuns very compact low temperature cofired ceramic (LTCC) system-in-package (SiP) transmitter module is presented for future wireless terminal applications. Five GaAs monolithic microwave integrated circuits (MMIC) chipsets including a power amplifier, driver amplifier, mixer, and two frequency multipliers are integrated into a LTCC multilayer circuit for the heterodyne transmitter. The fabricated transmitter module achieves an output of 13 dBm at a RF frequency of 62 GHz, an IF frequency of 2.4 GHz, and an local oscillator frequency of 59.6 GHz. The up-conversion gain is I I dB; while the local oscillator Signal is suppressed below -20.6 dBc with the image rejection mixer, and the image and spurious signals are also suppressed below -29.6 dBc. (c) 2007 Wiley Periodicals, Inc.-
dc.languageEnglish-
dc.publisherJOHN WILEY & SONS INC-
dc.titleA very compact 62-GHz transmitter LTCC SiP module for wireless terminals applications-
dc.typeArticle-
dc.identifier.wosid000244102500025-
dc.identifier.scopusid2-s2.0-33847758671-
dc.type.rimsART-
dc.citation.volume49-
dc.citation.beginningpage575-
dc.citation.endingpage578-
dc.citation.publicationnameMICROWAVE AND OPTICAL TECHNOLOGY LETTERS-
dc.identifier.doi10.1002/mop.22211-
dc.contributor.localauthorPark, Chul Soon-
dc.contributor.nonIdAuthorLee, YC-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorLTCC-
dc.subject.keywordAuthorSiP-
dc.subject.keywordAuthortransmitter-
dc.subject.keywordAuthor60 GHz-
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