DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jee, YK | ko |
dc.contributor.author | Ko, YH | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2013-03-07T07:37:30Z | - |
dc.date.available | 2013-03-07T07:37:30Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-07 | - |
dc.identifier.citation | JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887 | - |
dc.identifier.issn | 0884-2914 | - |
dc.identifier.uri | http://hdl.handle.net/10203/89713 | - |
dc.description.abstract | Varying, amounts of Zn (1, 3, and 7 wt%) were added to Sn-3.5Ag solder on a Cu pad, and the resultant solder joint microstructures after a reflow and isothermal aging (150 degrees C, up to 500 h) were investigated using scanning electron microscopy, energy dispersive x-ray, and x-ray diffraction, which were subsequently correlated to the results of microhardness and drop tests. Zinc was effective in improving the drop resistance of Sn-3.5Ag solder on the Cu pad, and an addition of 3 wt% Zn nearly doubled the number of drops-to-failure (N-f). The beneficial role of Zn was ascribed to suppression of Cu6Sn5 and precipitation of Zn-containing intermetallic compounds (IMCs). However, the Zn effect was reduced as Cu6Sn5 and Ag3Sn precipitated in a joint IMC layer after prolonged aging. The interface between Ag5Zn8 and Cu5Zn8 was resistant to drop impact, but two other layered IMC structures of Cu6Sn5/Cu3Sn and Cu5Zn8/Cu6Sn5 were not. | - |
dc.language | English | - |
dc.publisher | CAMBRIDGE UNIV PRESS | - |
dc.subject | LEAD-FREE SOLDERS | - |
dc.subject | INTERFACIAL REACTIONS | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | AG SOLDER | - |
dc.subject | P CONTENT | - |
dc.subject | MICROSTRUCTURE | - |
dc.subject | JOINTS | - |
dc.subject | STRENGTH | - |
dc.subject | GROWTH | - |
dc.subject | ALLOY | - |
dc.title | Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad | - |
dc.type | Article | - |
dc.identifier.wosid | 000247794300015 | - |
dc.identifier.scopusid | 2-s2.0-34547106589 | - |
dc.type.rims | ART | - |
dc.citation.volume | 22 | - |
dc.citation.issue | 7 | - |
dc.citation.beginningpage | 1879 | - |
dc.citation.endingpage | 1887 | - |
dc.citation.publicationname | JOURNAL OF MATERIALS RESEARCH | - |
dc.identifier.doi | 10.1557/jmr.2007.0234 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Jee, YK | - |
dc.contributor.nonIdAuthor | Ko, YH | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | LEAD-FREE SOLDERS | - |
dc.subject.keywordPlus | INTERFACIAL REACTIONS | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | AG SOLDER | - |
dc.subject.keywordPlus | P CONTENT | - |
dc.subject.keywordPlus | MICROSTRUCTURE | - |
dc.subject.keywordPlus | JOINTS | - |
dc.subject.keywordPlus | STRENGTH | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | ALLOY | - |
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