DC Field | Value | Language |
---|---|---|
dc.contributor.author | Ahn, Heejoon | ko |
dc.contributor.author | Lee, Keon Jae | ko |
dc.contributor.author | Childs, William R. | ko |
dc.contributor.author | Rogers, John A. | ko |
dc.contributor.author | Nuzzo, Ralph G. | ko |
dc.contributor.author | Shim, Anne | ko |
dc.date.accessioned | 2013-03-07T03:57:20Z | - |
dc.date.available | 2013-03-07T03:57:20Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-10 | - |
dc.identifier.citation | JOURNAL OF APPLIED PHYSICS, v.100, no.8 | - |
dc.identifier.issn | 0021-8979 | - |
dc.identifier.uri | http://hdl.handle.net/10203/89344 | - |
dc.description.abstract | We describe a technique for fabricating micron and submicron-sized polydimethylsiloxane (PDMS) patterns on electronic material substrates using decal transfer lithography (DTL) in conjunction with reactive ion-beam etching (RIE). We validate the use of this unconventional polymeric system as a suitable resist material for fabricating Si-based microelectronic devices. In this process, an O-2/CF4 gas mixture was used to etch a supporting PDMS thin film that resides atop a closed-form decal polymer to reveal conventional resist structures. These structures provide an effective latent image that, in turn, provides for an extension of soft lithography as a form of multilayer lithography-one yielding submicron structures similar to those obtained from the conventional photochemical methods used to prepare such resists. This combined DTL/RIE patterning procedure was found to be compatible with commercially available planarization layers and provides a direct means for preparing high aspect ratio resist features. We illustrate the applicability of soft lithography as a means for fabricating electronic devices by using it to prepare model silicon-based thin-film transistors exploiting silicon-on-insulator wafer technology. (c) 2006 American Institute of Physics. | - |
dc.language | English | - |
dc.publisher | AMER INST PHYSICS | - |
dc.subject | SELF-ASSEMBLED MONOLAYERS | - |
dc.subject | CONFORMABLE PHASE MASKS | - |
dc.subject | SOFT LITHOGRAPHY | - |
dc.subject | ELASTOMERIC STAMP | - |
dc.subject | MICROSTRUCTURES | - |
dc.subject | DEPOSITION | - |
dc.subject | RESOLUTION | - |
dc.subject | POLYMERS | - |
dc.subject | SURFACES | - |
dc.subject | SYSTEMS | - |
dc.title | Micron and submicron patterning of polydimethylsiloxane resists on electronic materials by decal transfer lithography and reactive ion-beam etching: Application to the fabrication of high-mobility, thin-film transistors | - |
dc.type | Article | - |
dc.identifier.wosid | 000241721900119 | - |
dc.identifier.scopusid | 2-s2.0-33750517818 | - |
dc.type.rims | ART | - |
dc.citation.volume | 100 | - |
dc.citation.issue | 8 | - |
dc.citation.publicationname | JOURNAL OF APPLIED PHYSICS | - |
dc.identifier.doi | 10.1063/1.2356784 | - |
dc.contributor.localauthor | Lee, Keon Jae | - |
dc.contributor.nonIdAuthor | Ahn, Heejoon | - |
dc.contributor.nonIdAuthor | Childs, William R. | - |
dc.contributor.nonIdAuthor | Rogers, John A. | - |
dc.contributor.nonIdAuthor | Nuzzo, Ralph G. | - |
dc.contributor.nonIdAuthor | Shim, Anne | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | SELF-ASSEMBLED MONOLAYERS | - |
dc.subject.keywordPlus | CONFORMABLE PHASE MASKS | - |
dc.subject.keywordPlus | SOFT LITHOGRAPHY | - |
dc.subject.keywordPlus | ELASTOMERIC STAMP | - |
dc.subject.keywordPlus | MICROSTRUCTURES | - |
dc.subject.keywordPlus | DEPOSITION | - |
dc.subject.keywordPlus | RESOLUTION | - |
dc.subject.keywordPlus | POLYMERS | - |
dc.subject.keywordPlus | SURFACES | - |
dc.subject.keywordPlus | SYSTEMS | - |
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