DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kang, SK | ko |
dc.contributor.author | Lee, TW | ko |
dc.contributor.author | Hwang, SH | ko |
dc.contributor.author | Cho, MH | ko |
dc.contributor.author | Park, HyoHoon | ko |
dc.date.accessioned | 2013-03-07T00:17:29Z | - |
dc.date.available | 2013-03-07T00:17:29Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-07 | - |
dc.identifier.citation | ELECTRONICS LETTERS, v.42, no.14, pp.805 - 806 | - |
dc.identifier.issn | 0013-5194 | - |
dc.identifier.uri | http://hdl.handle.net/10203/88916 | - |
dc.description.abstract | A multichip module of an optical transmitter, which consists of flip-chip bonded 1 x 4 VCSELs on a CMOS driver array IC, is fabricated and demonstrated. The -3 dB bandwidth and adjacent crosstalk of the hybrid integration multichip module are about 4.5 GHz and less than -30 dB, respectively. The whole integrated multichip volume is 1.1 x 1.2 x 0.52 mm(3) for four channels. | - |
dc.language | English | - |
dc.publisher | INST ENGINEERING TECHNOLOGY-IET | - |
dc.subject | BOARD | - |
dc.title | Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs | - |
dc.type | Article | - |
dc.identifier.wosid | 000239467500016 | - |
dc.identifier.scopusid | 2-s2.0-33745771783 | - |
dc.type.rims | ART | - |
dc.citation.volume | 42 | - |
dc.citation.issue | 14 | - |
dc.citation.beginningpage | 805 | - |
dc.citation.endingpage | 806 | - |
dc.citation.publicationname | ELECTRONICS LETTERS | - |
dc.identifier.doi | 10.1049/el:20061274 | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.nonIdAuthor | Kang, SK | - |
dc.contributor.nonIdAuthor | Lee, TW | - |
dc.contributor.nonIdAuthor | Hwang, SH | - |
dc.contributor.nonIdAuthor | Cho, MH | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | BOARD | - |
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