Effects of the Annealing Temperature on the Fracture Behavior and Mechanical Properties of Electrodeposited Nickel Films
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Baek, Dong-Cheon | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-06T11:55:36Z | - |
| dc.date.available | 2013-03-06T11:55:36Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008 | - |
| dc.identifier.citation | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
| dc.identifier.issn | 1057-7157 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/86900 | - |
| dc.language | English | - |
| dc.publisher | IEEE-Inst Electrical Electronics Engineers Inc | - |
| dc.title | Effects of the Annealing Temperature on the Fracture Behavior and Mechanical Properties of Electrodeposited Nickel Films | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.publicationname | JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Baek, Dong-Cheon | - |
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