Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric

Abstract

The thermal stabilities of MOSFETs with high-K gate dielectric on both Si/ultrathin Ge/Si (SGS) and strained Si on relaxed Si1-xGex (SS) substrates are studied. Though an initial drivability enhancement of 29% is shown for the SGS nMOSFET, annealing at 750 degrees C has resulted in drastic degradation in its drivability, lowering its Id beyond that of the Si nMOSFETs by 52%. Despite lowering in the junction leakage current, Ge diffusion to the near surface region, indicated by V-th and surface roughness change, degrades the SGS device performance significantly. For the SS nMOSFET, drivability varies with Ge content, whereby a maximum of 86% improvement over that of the Si nMOSFET is observed for 30% Ge. In contrast to the SGS nMOSFET, the SS nMOSFET is able to retain its Id improvement, even after annealing at 950 degrees C, as the in-plane tensile strain is preserved. Ge diffusion to the surface does not affect the device significantly, as the strained Si thickness is about 10 nm compared to a Si cap thickness of only 1.5 nm for the SGS substrate.