Optical interconnection platform composed of fiber-embedded board, 90 degrees-bent fiber block, and 10-Gb/s optical module

Abstract

An architecture of a passively assembled optical platform is suggested for a chip-to-chip optical interconnection system. The platform is constructed using all-fiber media for the optical paths: a fiber-embedded optical printed-circuit board (OPCB) and 90 degrees-bent fiber connector. The passive assembling was achieved by employing the guide pins/holes of commercialized ferrules in the optical link between the OPCB, 90 degrees-bent fiber connector, and the transmitter/receiver (Tx/Rx) module. From this interconnection scheme, a low total optical loss of -5.3 dB was obtained. From an assembled platform with 1.0 Gb/s/ch x 4 ch Tx/Rx modules, a 7-Gb/s/ch data transmission was demonstrated with a bit error rate below 10(-12), involving the optical and electrical crosstalk arisen in the whole channel operation.