박판 몰드를 이용한 솔더 범프 패턴의 형성 공정Fabrication of Solder Bump Pattern Using Thin Mold

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dc.contributor.author이제학ko
dc.contributor.author남동진ko
dc.contributor.author유중돈ko
dc.date.accessioned2013-03-06T07:19:20Z-
dc.date.available2013-03-06T07:19:20Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-04-
dc.identifier.citation대한용접접합학회지, v.25, no.2, pp.76 - 81-
dc.identifier.issn1225-6153-
dc.identifier.urihttp://hdl.handle.net/10203/86253-
dc.languageKorean-
dc.publisher대한용접접합학회-
dc.title박판 몰드를 이용한 솔더 범프 패턴의 형성 공정-
dc.title.alternativeFabrication of Solder Bump Pattern Using Thin Mold-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume25-
dc.citation.issue2-
dc.citation.beginningpage76-
dc.citation.endingpage81-
dc.citation.publicationname대한용접접합학회지-
dc.identifier.kciidART001052457-
dc.contributor.localauthor유중돈-
dc.contributor.nonIdAuthor이제학-
dc.contributor.nonIdAuthor남동진-
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