Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications

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dc.contributor.authorCho, HSko
dc.contributor.authorKang, Sko
dc.contributor.authorRho, BSko
dc.contributor.authorPark, HyoHoonko
dc.contributor.authorShin, KUko
dc.contributor.authorHa, SWko
dc.contributor.authorRhee, BHko
dc.contributor.authorKim, DSko
dc.contributor.authorJung, STko
dc.contributor.authorKim, Tko
dc.date.accessioned2013-03-04T21:07:15Z-
dc.date.available2013-03-04T21:07:15Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2004-12-
dc.identifier.citationOPTICAL ENGINEERING, v.43, no.12, pp.3083 - 3088-
dc.identifier.issn0091-3286-
dc.identifier.urihttp://hdl.handle.net/10203/84144-
dc.description.abstractA simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes With no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated conventional PCB processes at a temperature of 180degreesC for 1 h under 47 kg/cm(2) of pressure. The 50/125-mum glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about +/-5 mum. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than +/-0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated. (C) 2004 Society of Photo-Optical Instrumentation, Engineers.-
dc.languageEnglish-
dc.publisherSPIE-SOC PHOTOPTICAL INSTRUMENTATION ENGINEERS-
dc.titleFabrication of fiber-embedded boards using grooving technique for optical interconnection applications-
dc.typeArticle-
dc.identifier.wosid000226071600037-
dc.identifier.scopusid2-s2.0-19944430948-
dc.type.rimsART-
dc.citation.volume43-
dc.citation.issue12-
dc.citation.beginningpage3083-
dc.citation.endingpage3088-
dc.citation.publicationnameOPTICAL ENGINEERING-
dc.identifier.doi10.1117/1.1810530-
dc.contributor.localauthorPark, HyoHoon-
dc.contributor.nonIdAuthorCho, HS-
dc.contributor.nonIdAuthorKang, S-
dc.contributor.nonIdAuthorRho, BS-
dc.contributor.nonIdAuthorShin, KU-
dc.contributor.nonIdAuthorHa, SW-
dc.contributor.nonIdAuthorRhee, BH-
dc.contributor.nonIdAuthorKim, DS-
dc.contributor.nonIdAuthorJung, ST-
dc.contributor.nonIdAuthorKim, T-
dc.type.journalArticleArticle-
dc.subject.keywordAuthoroptical printed circuit board-
dc.subject.keywordAuthorelectro-optical printed circuit board-
dc.subject.keywordAuthoroptical interconnection-
dc.subject.keywordAuthoroptical fiber-
dc.subject.keywordAuthorlamination-
dc.subject.keywordAuthorfiber-embedded board-
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