DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, HS | ko |
dc.contributor.author | Kang, S | ko |
dc.contributor.author | Rho, BS | ko |
dc.contributor.author | Park, HyoHoon | ko |
dc.contributor.author | Shin, KU | ko |
dc.contributor.author | Ha, SW | ko |
dc.contributor.author | Rhee, BH | ko |
dc.contributor.author | Kim, DS | ko |
dc.contributor.author | Jung, ST | ko |
dc.contributor.author | Kim, T | ko |
dc.date.accessioned | 2013-03-04T21:07:15Z | - |
dc.date.available | 2013-03-04T21:07:15Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004-12 | - |
dc.identifier.citation | OPTICAL ENGINEERING, v.43, no.12, pp.3083 - 3088 | - |
dc.identifier.issn | 0091-3286 | - |
dc.identifier.uri | http://hdl.handle.net/10203/84144 | - |
dc.description.abstract | A simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes With no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated conventional PCB processes at a temperature of 180degreesC for 1 h under 47 kg/cm(2) of pressure. The 50/125-mum glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about +/-5 mum. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than +/-0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated. (C) 2004 Society of Photo-Optical Instrumentation, Engineers. | - |
dc.language | English | - |
dc.publisher | SPIE-SOC PHOTOPTICAL INSTRUMENTATION ENGINEERS | - |
dc.title | Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications | - |
dc.type | Article | - |
dc.identifier.wosid | 000226071600037 | - |
dc.identifier.scopusid | 2-s2.0-19944430948 | - |
dc.type.rims | ART | - |
dc.citation.volume | 43 | - |
dc.citation.issue | 12 | - |
dc.citation.beginningpage | 3083 | - |
dc.citation.endingpage | 3088 | - |
dc.citation.publicationname | OPTICAL ENGINEERING | - |
dc.identifier.doi | 10.1117/1.1810530 | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.nonIdAuthor | Cho, HS | - |
dc.contributor.nonIdAuthor | Kang, S | - |
dc.contributor.nonIdAuthor | Rho, BS | - |
dc.contributor.nonIdAuthor | Shin, KU | - |
dc.contributor.nonIdAuthor | Ha, SW | - |
dc.contributor.nonIdAuthor | Rhee, BH | - |
dc.contributor.nonIdAuthor | Kim, DS | - |
dc.contributor.nonIdAuthor | Jung, ST | - |
dc.contributor.nonIdAuthor | Kim, T | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | optical printed circuit board | - |
dc.subject.keywordAuthor | electro-optical printed circuit board | - |
dc.subject.keywordAuthor | optical interconnection | - |
dc.subject.keywordAuthor | optical fiber | - |
dc.subject.keywordAuthor | lamination | - |
dc.subject.keywordAuthor | fiber-embedded board | - |
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