DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, BW | ko |
dc.contributor.author | Jeong, JH | ko |
dc.contributor.author | Jang, W | ko |
dc.contributor.author | Kim, JY | ko |
dc.contributor.author | Kim, DW | ko |
dc.contributor.author | Kwon, D | ko |
dc.contributor.author | Nah, JW | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2013-03-04T18:57:46Z | - |
dc.date.available | 2013-03-04T18:57:46Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-04 | - |
dc.identifier.citation | INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.17, pp.1983 - 1988 | - |
dc.identifier.issn | 0217-9792 | - |
dc.identifier.uri | http://hdl.handle.net/10203/83724 | - |
dc.description.abstract | Many thermomechanical reliability studies on microelectronics and microsystems have relied upon computational analysis, since experimental work is rather difficult and very time-consuming. For computational analysis, it is essential to use as input accurate material properties; if not, the results of a reliability analysis may be very inaccurate. However, it is still quite difficult to arrive at unified material properties for modeling microelectronic assemblies because of the absence of standards for micro-material characterization, the difference between bulk and in-situ material properties, and so forth. The goal of this study was to determine the uniaxial stress-strain curve of a solder in a flip-chip assembly, using experimental measurements and finite-element analysis (FEA) of the solder's thermal deformation characteristics with increasing temperature. The thermal deformation of flip-chip solder joints was measured by electronic speckle pattern interferometry (ESPI). For the scale of evaluation required, the measurement magnification was modified to allow its application to micromaterials by using a long-working-distance microscope, iris and zoom lens. Local deformation of solder balls could be measured at submicrometer scale, and stress-strain curves could be determined using the measured thermal deformation as input data for finite-element analysis. The procedure was applied to an Sn-36Pb-2Ag flip-chip solder joint. | - |
dc.language | English | - |
dc.publisher | WORLD SCIENTIFIC PUBL CO PTE LTD | - |
dc.title | Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis | - |
dc.type | Article | - |
dc.identifier.wosid | 000183752800068 | - |
dc.identifier.scopusid | 2-s2.0-0037931789 | - |
dc.type.rims | ART | - |
dc.citation.volume | 17 | - |
dc.citation.beginningpage | 1983 | - |
dc.citation.endingpage | 1988 | - |
dc.citation.publicationname | INTERNATIONAL JOURNAL OF MODERN PHYSICS B | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, BW | - |
dc.contributor.nonIdAuthor | Jeong, JH | - |
dc.contributor.nonIdAuthor | Jang, W | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Kim, DW | - |
dc.contributor.nonIdAuthor | Kwon, D | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
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