Current Status and Forecast on Development of Metal Matrix Composites for Electronic Packaging Applications전자패키징용 금속복합재료의 개발현황 및 전망
- Publisher
- 대한금속재료학회
- Issue Date
- 2001-12
- Language
- Korean
- Citation
재료마당, v.14, no.8, pp.18 - 27
- ISSN
- 1738-7507
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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