구리 도금층을 이용한 미세 열유속 센서The Micro Heat Flux Sensor using Electroplated Copper layers

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New types of the micro heat flux sensor are designed and fabricated using SU-8 and Cu electroplating. And then calibrated under convection environment. The thermal path was made by SU-8 structure and electroplated Cu layers. The bottom surface of the micro heat flux sensor receives the heat flux from the wall, Then the heat flows along the Cu layers and drains out to the environment with producing the temperature difference at the upper layer of Cu. By measuring this temperature difference, the heat flux from the wall can be obtained. The temperature difference is measured by thermopile which is composed of Ni-Cr pairs or Al-chromel pairs. The calibration is accomplished under convection environment because it is most frequent situation. The range of the sensitivity is 0.11~2.02μV/(㎽/cm²) for the various heat flux and Reynolds numbers.
Publisher
한국정밀공학회
Issue Date
2000-07
Language
Korean
Citation

한국정밀공학회지, v.17, no.7, pp.226 - 231

ISSN
1225-9071
URI
http://hdl.handle.net/10203/78141
Appears in Collection
ME-Journal Papers(저널논문)
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