Effects of heat treatment at 350 degrees C on the adhesion of Cu-Cr alloy films to polyimide

Abstract

CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide films were maintained under 350 degrees C/N-2 environment up to 10 hours for the reliability measurements. The Cr contents of the alloy layer prepared were 0, 8.5, 17, 25, 34, and 100 atomic %, respectively. Before exposures to 350 degrees C, the peel strength increased proportionally with the Cr content in the alloy layer up to 17 atomic % and saturated. The failure occurred inside polyimide near the metal/polyimide interface by the cohesive failure mode except for the specimen with no Cr. After exposures to 350 degrees C, the peel strength dropped for all the specimens, but most drastically for the specimens with 8.5% Cr which failed along the Cr-oxide/polyimide interface by the interfacial failure mode. Through AES and XPS analyses, it was shown that the decrease of the peel strength during the heat treatment was primarily caused by the formation of brittle Cr2O3 at the metal/polyimide interface, which was accompanied by the reduction of carbidic bonds responsible for the good adhesion. (C) 2000 Kluwer Academic Publishers.