DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, HY | ko |
dc.contributor.author | Yu, Jin | ko |
dc.date.accessioned | 2013-03-03T05:50:16Z | - |
dc.date.available | 2013-03-03T05:50:16Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-12 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.28, no.12, pp.1444 - 1447 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/77497 | - |
dc.description.abstract | Cu-based leadframe sheets were oxidized in alkaline solutions to produce brown and/or black oxide on the surfaces, and molded with epoxy molding compound (EMC). The adhesion strength of leadframe/EMC interface was measured using sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens. Results showed that the adhesion strength of leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates. The presence of smooth-faceted Cu(2)O on the surface of the leadframe gave close to zero fracture toughness (G(C)) and suitable pull strength (PS). A direct correlation between G(C) and PS showed that PS can be a measure of G(C) only in a limited range. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | COPPER | - |
dc.subject | IMPROVEMENT | - |
dc.subject | TOUGHNESS | - |
dc.title | Adhesion strength of leadframe/EMC interfaces | - |
dc.type | Article | - |
dc.identifier.wosid | 000084449600023 | - |
dc.identifier.scopusid | 2-s2.0-0033281288 | - |
dc.type.rims | ART | - |
dc.citation.volume | 28 | - |
dc.citation.issue | 12 | - |
dc.citation.beginningpage | 1444 | - |
dc.citation.endingpage | 1447 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1007/s11664-999-0138-3 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Lee, HY | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | Cu-based leadframe | - |
dc.subject.keywordAuthor | EMC | - |
dc.subject.keywordAuthor | adhesion strength | - |
dc.subject.keywordAuthor | interfacial fracture toughness | - |
dc.subject.keywordAuthor | pull strength | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | IMPROVEMENT | - |
dc.subject.keywordPlus | TOUGHNESS | - |
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