Multi-level modeling of effective elastic behavior and progressive weakened interface in particulate composites

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This paper proposes a multi-level elastic damage model based on a combination of a micromechanical formulation and a multi-level damage model to predict the effective elastic behavior and progressive weakened interface in particulate composites. The progression of weakened interface is assumed to be gradual and sequential. A multi-level damage model in accordance with the Weibull's probabilistic function is developed to describe a sequential, progressive weakened interface in the composites. The Eshelby's tensor for an ellipsoidal inclusion with slightly weakened interface [Qu J. Eshelby tensor for an elastic inclusion with slightly weakened interfaces. J Appl Mech 1993;60:1048-50; Qu J. The effect of slightly weakened interfaces on the overall elastic properties of composite materials. Mech Mater 1993;14:269-81] is adopted to model particles having mildly or severely weakened interface and is incorporated into the micromechanical formulation by Ju and Chen [Ju JW, Chen TM. Micromechanics and effective elastoplastic behavior of two-phase metal matrix composites, J Eng Mater 1994; 116:310-18]. A numerical example corresponding to uniaxial tension loading is solved to illustrate the potential of the proposed multi-level elastic damage model. A parametric analysis is also carried out to address the influence of model parameters on the progressive weakened interface in the composites. Furthermore, the present predictions are compared with available experimental data in the literature to further illustrate the elastic damage behavior of the present framework and to verify the validity of the proposed multi-level elastic damage model. (C) 2007 Elsevier Ltd. All rights reserved.
Publisher
ELSEVIER SCI LTD
Issue Date
2008-02
Language
English
Article Type
Article
Citation

COMPOSITES SCIENCE AND TECHNOLOGY, v.68, no.2, pp.387 - 397

ISSN
0266-3538
DOI
10.1016/j.compscitech.2007.06.026
URI
http://hdl.handle.net/10203/7570
Appears in Collection
CE-Journal Papers(저널논문)
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