High Performance EEPROMs Using N- and P-Channel Polysilicon Thin Film Transistors with Electron Cyclotron Resonance N2O-Plasma Oxide

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dc.contributor.authorN.I.Leeko
dc.contributor.authorJ.W. Leeko
dc.contributor.authorC.H.Hanko
dc.date.accessioned2013-02-28T04:37:23Z-
dc.date.available2013-02-28T04:37:23Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1999-01-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v.20, no.1, pp.15 - 17-
dc.identifier.issn0741-3106-
dc.identifier.urihttp://hdl.handle.net/10203/72809-
dc.description.abstractHigh-performance EEPROM's using n- and p-channel polysilicon thin-film transistors (poly-Si TFT's) with electron cyclotron resonance (ECR) NaO-plasma oxide have been demonstrated. Both programming and erasing were accomplished by Fowler-Nordheim (F-N) tunneling within 1 ms regardless of programming and erasing voltages. The poly-Si TFT EEPROM's have a threshold voltage shift of 4 V between programmed and erased states; furthermore, maintain a large threshold voltage shift of 2.5 V after 1 x 10(5) program and erase cycles. This is attributed to the excellent charge-to-breakdown (Qbd) up to 10 C/cm(2) of ECR N2O-plasma oxide.-
dc.languageEnglish-
dc.publisherIEEE-Inst Electrical Electronics Engineers Inc-
dc.subjectPLASMA-
dc.titleHigh Performance EEPROMs Using N- and P-Channel Polysilicon Thin Film Transistors with Electron Cyclotron Resonance N2O-Plasma Oxide-
dc.typeArticle-
dc.identifier.wosid000077934100005-
dc.identifier.scopusid2-s2.0-0002796231-
dc.type.rimsART-
dc.citation.volume20-
dc.citation.issue1-
dc.citation.beginningpage15-
dc.citation.endingpage17-
dc.citation.publicationnameIEEE ELECTRON DEVICE LETTERS-
dc.contributor.localauthorC.H.Han-
dc.contributor.nonIdAuthorN.I.Lee-
dc.contributor.nonIdAuthorJ.W. Lee-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorEEPROM-
dc.subject.keywordAuthorECR N2O-plasma oxide-
dc.subject.keywordAuthorendurance-
dc.subject.keywordAuthorpoly-Si TFT-
dc.subject.keywordAuthorQbd-
dc.subject.keywordPlusPLASMA-
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