DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, WK | ko |
dc.contributor.author | Lee, HyuckMo | ko |
dc.date.accessioned | 2013-02-28T00:35:40Z | - |
dc.date.available | 2013-02-28T00:35:40Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-07 | - |
dc.identifier.citation | JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, no.S, pp.344 - 2 | - |
dc.identifier.issn | 0374-4884 | - |
dc.identifier.uri | http://hdl.handle.net/10203/71771 | - |
dc.description.abstract | The interfacial reaction at the interface between solders and substrates was studied both in the liquid and the solid states, especially with a focus on the intermetallic compound thereafter, IMC) phase formed. The solder systems of Sn-3.5Ag and Sn-3.5Ag-8.5In (in wt%) were selected from the phase equilibria calculations. The calculated phase diagram agreed well with measurements by differential scanning calorimetry and X-ray diffractometry. Four types of substrates were used: Cu, Cu/Sn, Cu/Ni, and Cu/Ni/Pd. The interface was observed by the use of scanning electron microscopy, and the compositions of the IMC at the interface were measured by energy-dispersive X-ray analyses. The growth kinetics of the IMC followed a parabolic-type behavior and palladium was very effective as a diffusion barrier element. | - |
dc.language | English | - |
dc.publisher | KOREAN PHYSICAL SOC | - |
dc.subject | DIFFUSION COUPLES | - |
dc.subject | GROWTH | - |
dc.title | Interfacial reaction between Sn-Ag-based solder alloys and substrates | - |
dc.type | Article | - |
dc.identifier.wosid | 000081827900070 | - |
dc.identifier.scopusid | 2-s2.0-0033415633 | - |
dc.type.rims | ART | - |
dc.citation.volume | 35 | - |
dc.citation.issue | S | - |
dc.citation.beginningpage | 344 | - |
dc.citation.endingpage | 2 | - |
dc.citation.publicationname | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.contributor.localauthor | Lee, HyuckMo | - |
dc.contributor.nonIdAuthor | Choi, WK | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordPlus | DIFFUSION COUPLES | - |
dc.subject.keywordPlus | GROWTH | - |
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