This letter presents an electro-acoustic circuit fabricated on quartz directly bonded on the processed silicon wafer (QoS), which allows us to polylithically integrate high precision passives with integrated circuits. We first fabricated a prototype SAW resonator and oscillator on thick QoS. The SAW resonator on QoS shows Q about 10,000 and 11 dB insertion loss at 289 MHz, and SAW oscillator on QoS shows phase noise of as small as -120 dBc at 100 kHz offset, demonstrating the feasibility of true single chip radio.