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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate

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dc.contributor.authorYoon, SWko
dc.contributor.authorChoi, WKko
dc.contributor.authorLee, HyuckMoko
dc.date.accessioned2013-02-27T22:25:21Z-
dc.date.available2013-02-27T22:25:21Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1999-
dc.identifier.citationSCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332-
dc.identifier.issn1359-6462-
dc.identifier.urihttp://hdl.handle.net/10203/71194-
dc.languageEnglish-
dc.publisherPergamon-Elsevier Science Ltd-
dc.subjectSN-
dc.subjectDIFFUSION-
dc.subjectSYSTEM-
dc.subjectALLOYS-
dc.subjectJOINTS-
dc.subjectCOPPER-
dc.titleInterfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate-
dc.typeArticle-
dc.identifier.wosid000078767700010-
dc.identifier.scopusid2-s2.0-0033534274-
dc.type.rimsART-
dc.citation.volume40-
dc.citation.issue3-
dc.citation.beginningpage327-
dc.citation.endingpage332-
dc.citation.publicationnameSCRIPTA MATERIALIA-
dc.contributor.localauthorLee, HyuckMo-
dc.contributor.nonIdAuthorYoon, SW-
dc.contributor.nonIdAuthorChoi, WK-
dc.type.journalArticleArticle-
dc.subject.keywordPlusSN-
dc.subject.keywordPlusDIFFUSION-
dc.subject.keywordPlusSYSTEM-
dc.subject.keywordPlusALLOYS-
dc.subject.keywordPlusJOINTS-
dc.subject.keywordPlusCOPPER-
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