Browse "College of Engineering(공과대학)" by Type Conference
Showing results 69681 to 69700 of 90910
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi S., 10th International Conference on Composite Structures, v.47, no.40547, pp.695 - 703, 1999-11-15 |
| Thermal buckling of composite beam with embedded shape memory alloy actuators Lee, Jungju, Proceeding of ICCM, pp.0 - 0, ICCM, 1999-07-05 |
| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal characteristics of pulsating heat pipes operating in a circulation mode Noh, Hyung Yoon; Kim, Sung-Jin, International Mechanical Engineering Congress & Exposition, ASME, 2016-11-13 |
| Thermal characteristics of samarium-based composite cathode(Sm0.5Sr0.5CoO3/Sm0.2Ce0.8O1.9) for intermediate temperature-operating solid oxide fuel cell 백승욱; 배중면, KSME 2007 Annual Spring Conference, KSME, 2007-05-30 |
| Thermal characterization of a BGA NVMe solid state drive in Mini-ITX system Lee, Eungchang; Kang, H; Lee, Jungchul; Lee, Bong Jae, The 2nd Pacific Rim Thermal Engineering Conference, JSME, KSME, ASTFE, 2019-12-17 |
| Thermal characterization of liquid analytes via photothermal modulation of microfluidic resonators Yoon, Yeowon; Khan, Faheem; Thundat, Thomas; Lee, Jungchul, The 32nd International Conference on Micro Electro Mechanical Systems, pp.712 - 715, The Society of Micro and Nano Systems, 2019-01-28 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee, WS; Han, Y; Yu, Jin; Kim, SJ; Lee, TY, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.47 - 52, 2005-12-08 |
| Thermal Conductance of Multiple Vacuum/Plate Layer Yoon, I.S.; Song, Tae-Ho, Proc. 1st Int'l Forum on Heat Transfer, pp.213 - 214, 2004 |
| Thermal conductivity measurement of liquid metal with 3-omega method Kim, Dongmin; Kim, Taeyeong; Lee, Jungchul; Lee, Bong Jae, The 2nd Pacific Rim Thermal Engineering Conference, JSME, KSME, ASTFE, 2019-12-17 |
| Thermal conductivity measurement of silicon/silicide laminated structures by 3w method Choi, Won Cheol; Kim, Jun Soo; Kim, Soo Jeong; Kim, Tae Kwang; Jung, Heun Dal; Jung, Tae Hyung; Nam, Eun Soo; et al, 2015 European Materials Research Society (EMRS) Spring Meeting, EMRS, 2015-05-14 |
| Thermal conductivity modeling of the interaction layer of the irradiated U-Mo dispersion fuel Mistarihi, Qusai; 류호진, 한국원자력학회 2018 춘계학술발표회, 한국원자력학회, 2018-05-17 |
| Thermal conductivity of hydrate-bearing sediments in the Ulleung basin Kwon, Tae-Hyuk; Kim, AR; Chang, I; Cho, GC; Lee, JH, The 22th KKCNN Symposium on Civil engineering, Chulalongkorn University, 2009-12 |
| Thermal conductivity of ultrathin Si films with a periodic pore pattern Oh, Jung Hyun; Choi, Won Chul; Jang, Moon Kyu; Shin, Mincheol, 17th International Workshop on Computational Electronics, IWCE 2014, 2014-06-06 |
| Thermal coupling of HTGRs and MED desalination plants, and its performance and cost analysis for nuclear desalination Kim, Ho Sik; No, Hee Cheon, Barcelona 2012, 2012-04 |
| Thermal crack initiation mechanism at high alloy steel slab with phase transformation Lee, Yong Seok; Kim, Seong-Woo; Lee, Soon-Bok, Fatigue 2014 (11th International fatigue congress), Fatigue 2014, 2014-03-04 |
| Thermal crack initiation of high alloy steel slab after continuous casting process through finite element analysis Lee, Yong Seok; Kim, Seong Woo; Lee, You Ho; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| THERMAL CREEP CORRELATIONS OF FERRITIC/MARTENSITIC STEELS FOR ADVANCED NUCLEAR REACTORS Ryu, Ho Jin; Kim, YS; Yacout, AM; Hofman, GL, The Sixth Pacific Rim International Conference on Advanced Materials and Processing, PRICM, 2007-11 |
| Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008 |
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