Browse "College of Engineering(공과대학)" by Type Conference
Showing results 46381 to 46400 of 90910
| Modeling and Analysis of High Speed Switching Buck Converter IC for Conducted Emission Estimation Park, Jaehyoung; Song, Chiuk; Park, Jonghyun; Kweon, Hycksu; Ahn, Seungyoung; Fan, Jun; Kim, Hongseok, 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, EMC EUROPE 2020, Institute of Electrical and Electronics Engineers Inc., 2020-09 |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
| Modeling and analysis of internal impact for general classes of robotic mechanisms Lee S.H.; Yi B-J.; Kim S.H.; Kwak, Yoon Keun, 2000 IEEE/RSJ International Conference on Intelligent Robots and Systems, v.3, pp.1955 - 1962, IEEE, 2000-10-31 |
| Modeling and analysis of millimeter/sub-millimeter wave indoor communications for multi-gigabit wireless transmission Choi, Yonghoon; Han, Youngnam, 39th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2014, IEEE Computer Society, 2014-09 |
| Modeling and Analysis of Mis-Rounting Calls in Universal Personal Telecommunication Services in Fixed Networks Sung, Dan Keun; Chung, YW; Kwon, SJ, IEICE APCC 2001, pp.264 - 267, 2001-09 |
| Modeling and analysis of multiple coupled through-silicon vias (TSVs) for 2.5-D/3-D ICs Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gap Yeol; et al, Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.346 - 349, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Modeling and Analysis of Open Defect in Through Silicon Via (TSV) Channel Kim, Joungho; Jung, Daniel H; Kim, Heegon; Kim, Jonghoon J; Bae, Hyun-Cheol; Choi, Kwangseong, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.163 - 166, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15 |
| Modeling and analysis of power for System-on-a-Chip design Nair, I.I.; Shin, Youngsoo; Bergamaschi, R.A.; Bhattacharya, S; Darringer, J; Kosonocky, S, IBM Austin Conference on Energy-Efficient Design (ACEED), IBM, 2003-03 |
| Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06 |
| Modeling and Analysis of Re-entrant Production Systems Jang, Young Jae, Singapore-MIT Alliance Annual Symposium, 2006-01-17 |
| Modeling and Analysis of Return Paths of Common Mode EMI Noise Currents From Motor Drive System in Hybrid Electric Vehicle Kim, Joungho; Hongseok Kim; Jinwook Song; Younghwan Kwack; Dong-Hyun Kim; Eulyong Kim, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2015-05-26 |
| Modeling and Analysis of SMA Actuator Embedded in Stretchable Coolant Vascular Pursuing Artificial Muscles Jeong, Jaeyeon; Hoon Park, Cheol; Kyung, Ki-Uk, IEEE International Conference on Robotics and Automation, ICRA 2020, Institute of Electrical and Electronics Engineers Inc., 2020-05-31 |
| Modeling and Analysis of Stochastic Cyclic Flow Lines with Blocking Lee, Y.; Lee, Tae-Eog, 대한산업공학회 추계학술대회, pp.1 - 7, 대한산업공학회, 1997-09 |
| Modeling and Analysis of Stocker System in Semiconductor Jang, Young Jae, International Symposium on Semiconductor Manufacturing, 2005-09-14 |
| Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
| Modeling and Analysis of The Charging Infrastructure Allocation For A Multiple-Route Service Dynamic Wireless Charging Transportation System Using A Genetic Algorithm Lee, Min Seok; Jeong, Seung Min; Jang, Young Jae, 45th International Conference on Computers & Industrial Engineering, 2015, Computers & Industrial Engineering, 2015-10-30 |
| Modeling and analysis of two feedback loop dynamics in Ras/Raf-1/MEK/ERK signaling pathway Cho, Kwang-Hyun; Shin, SY; Kolch, W; Wolkenhauer, O, 5th Int. Conf. on Systems Biology (ICSB2004), pp.168 - 168, 2004-10 |
| Modeling and Analysis of Variable User Mobility in Future Wireless Personal Communications Lee, K-D; Kim, Sehun, INFORMS & KORMS, 2000 |
| Modeling and analysis on cyclic operation of fiber sorbent for direct air capture 정호원; 이재형, 한국화학공학회 2021년도 가을 총회 및 학술대회, 한국화학공학회, 2021-10-28 |
| Modeling and Analysis Requirements of Service-Oriented Communications Software Using Use Cases Kwon, Yong Rae, Advanced Communicaton Technology(ICACT 2001), 2001 |
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