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(A) study on the thermal properties of underfill in flip-chip package = 플립칩용 언더필의 열적물성에 관한 연구link Lee, Woong-Sun; 이웅선; et al, 한국과학기술원, 2005 |
Exothermic reaction induced eutectic Pb-Sn solder ball melting in the underfill curing process Kwon, WS; Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.172 - 176, 2004-03 |
Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
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