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Ultralow-k Amorphous Boron Nitride Film for Copper Interconnect Capping Layer

Kim, Kiryong; Kim, Hyeongjoon; Lee, Sun-Woo; Lee, Min Yung; Lee, Gyusoup; Park, Youngkeun; Kim, Heetae; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.5, pp.2588 - 2593, 2023-05

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