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Browse "College of Engineering(공과대학)" by Subject Ultra-fine pitch COF packages▼aAPL ACFs▼aSi chip flexibility▼ainterface adhesion▼amodulus▼adynamic bending reliability

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(A) study on the bending properties of ultra-fine pitch chip-on-flex (COF) packages using anchoring polymer layer (APL) anisotropic conductive films (ACFs)link

Yan, Pan; Paik, Kyoung-Wook; et al, 2021

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