Browse "College of Engineering(공과대학)" by Subject BUMP
Showing results 1 to 3 of 3
| Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
| Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics Jo, Jung-Lae; Lee, Jong-Bum; Lee, Jong-Gun; Jeon, Sung-Ho; Kim, Jong-Min; Shin, Young-Eui; Moon, Jeong-Hoon; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.7, pp.07GA01 - 07GA04, 2009-07 |
| Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards Lee, Jong-Bum; Koo, Ja-Myeong; Hong, Soon-Min; Shin, Hyoyoung; Moon, Youn-jin; Jung, Jae-Pil; Yoo, Choon-Don; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304, 2008-05 |
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