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Showing results 1 to 4 of 4

1
Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/ nano-Sn-3.0Ag-0.5Cu/Cu joints

Zhang, Shuai; Zhou, Hongzhi; Ding, Tianran; Long, Weimin; Zhong, Sujuan; Paik, Kyung-Wook; He, Peng; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.28, pp.1743 - 1751, 2024-01

2
Impact of embedded susceptor mass and exposure time on morphological and property alterations in SAC305 joints using microwave hybrid heating

Zhang, Shuai; Zhou, Hongzhi; Ding, Tianran; Long, Weimin; Zhong, Sujuan; Paik, Kyung-Wook; He, Peng; et al, MATERIALS LETTERS, v.357, 2024-02

3
Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating

Zhang, Shuai; Zhang, Shuye; Zhou, Hongzhi; Paik, Kyung-Wook; Ding, Tianran; Long, Weimin; Zhong, Sujuan; et al, MATERIALS CHARACTERIZATION, v.207, 2024-01

4
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11

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