Browse "College of Engineering(공과대학)" by Author Tummala, Rao
Showing results 1 to 8 of 8
| Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB Kim, Joung-Ho; Kim, Youngwoo; Kim, Kiyeong; Cho, Jonghyun; Sundaram, Venky; Tummala, Rao, 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI), 2014-08-03 |
| Analysis of through glass via (TGV) noise coupling effect to noise figure of 2.4GHz LNA on glass interposer Hwang, Insu; Kim, Jihye; Kim, Youngwoo; Cho, Jong-Hyun; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.85 - 88, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers Kumar, Gokul; Raj, P. Markondeya; Cho, Jounghyun; Gandhi, Saumya; Chakraborti, Parthasarathi; Sundaram, Venky; Kim, Joungho; et al, 64th Electronic Components and Technology Conference, ECTC 2014, pp.541 - 547, Institute of Electrical and Electronics Engineers Inc., 2014-05 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV) Kim, Jihye; Hwang, Insu; Kim, Youngwoo; Kim, Heegon; Kim, Joungho; Sundaram, Venky; Tummala, Rao, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.93 - 96, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J.; Kim, Kiyeong; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.6, pp.1747 - 1759, 2016-12 |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gap Yeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; et al, MICROELECTRONICS JOURNAL, v.77, pp.66 - 72, 2018-07 |
| Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer Kim, Young Woo; Kim, Ki Yeong; Cho, Jong Hyun; Sundaram, Venky; Tummala, Rao; Kim, Joung Ho, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
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