Browse "College of Engineering(공과대학)" by Author Sung, M.
Showing results 1 to 5 of 5
| An efficient crosstalk parameter extraction method for high-speed interconnection lines Sung, M.; Ryu, W.; Kim, H.; Kim, J.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.2, pp.148 - 155, 2000-05 |
| Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
| Enzymatic Production of L-Tryptophan from Indole, Pyruvate and Ammonia using Thermostable Tryptophan Indole-lyase of Symbiobacterium Sp. SC-1: Effects of Nonionic Detergents on Denaturation of Tryptophan Indole-lyase and Solubility of Indole Cho, S.H; Lee, S.G; Park, J.S; Hong, S.P; Khang, T.J; Lee, SangYup; Sung, M., Annual Meeting of The Korean Society for Applied Microbiology, Korean Society for Applied Microbiology, 1999 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
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