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Showing results 1 to 6 of 6

1
Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints

Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07

2
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02

3
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02

4
The formation of Cu-Sn intermetallic compound and its effect on the fracture behavior of 80Sn-20Pb electrodeposits on Cu-based leadframe alloy

Kim, Jeong-Han; Suh, Min-Suk; Kwon, Hyuk-Sang, SURFACE COATINGS TECHNOLOGY, v.82, no.1-2, pp.23 - 28, 1996-07

5
메탄슬폰화욕에서 전착된 Sn 계 솔더 합금의 조성과 미세조직 및 솔더물성에 미치는 도금조건의 영향 = Effects of plating condition on composition, morphology, and solder properties of Sn solder alloy systems electrodeposited from methane sulfonate bathlink

서민석; Suh, Min-Suk; et al, 한국과학기술원, 2000

6
유기 슬폰화욕에서 전착된 Pb-Sn합금 도금층의 형상 및 파괴특성에 미치는 도금조건과 시효처리의영향 = Effects of plating condition and aging on the morphology and fracture characteristics of Pb-Sn electrodeposits from oraganic sulfonate bathlink

서민석; Suh, Min-Suk; et al, 한국과학기술원, 1995

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