Browse "College of Engineering(공과대학)" by Author Suh, BS
Showing results 1 to 6 of 6
| Barrier properties and failure mechanism of Ta-Si-N thin films for Cu interconnection Lee, YJ; Suh, BS; Kwon, MS; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.85, no.3, pp.1927 - 1934, 1999-02 |
| Co-sputter deposited Ta-Si diffusion barrier between Si and Cu: the effects of Si content on the barrier property Lee, YJ; Suh, BS; Park, Chong-Ook, THIN SOLID FILMS, v.357, no.2, pp.237 - 241, 1999-12 |
| Crystallization of amorphous WNx films Suh, BS; Cho, HK; Lee, YJ; Lee, WJ; Park, Chong-Ook, JOURNAL OF APPLIED PHYSICS, v.89, no.7, pp.4128 - 4133, 2001-04 |
| Properties of reactively sputtered WNx as Cu diffusion barrier Suh, BS; Lee, YJ; Hwang, JS; Park, Chong-Ook, THIN SOLID FILMS, v.348, no.1-2, pp.299 - 303, 1999-07 |
| Structural and chemical stability of Ta-Si-N thin film between Si and Cu Lee, YJ; Suh, BS; Rha, SK; Park, Chong-Ook, THIN SOLID FILMS, v.320, no.1, pp.141 - 146, 1998-05 |
| Surface hardening of AISI 316L stainless steel using plasma carburizing Suh, BS; Lee, Won-Jong, THIN SOLID FILMS, v.295, no.1-2, pp.185 - 192, 1997-02 |
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