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Showing results 1 to 10 of 10

1
20 GHz integrated CMOS frequency sources with a quadrature VCO using transformers

Ko, S.; Kim, J.-G.; Song, T.; Yoon, E.; Hong, Songcheol, Digest of Papers - 2004 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, pp.269 - 272, IEEE, 2004-06-06

2
A 2.4-GHz sub-mW CMOS current-reused receiver front-end for wireless sensor network

Song, T.; Oh, H.-S.; Baek, S.-H.; Hong, Songcheol; Yoon, E., 2006 IEEE Radio Frequency Integrated Circuits Symposium, pp.293 - 296, IEEE, 2006-06-11

3
A 2.4-GHz Sub-mW frequency source with current-reused frequency multiplier

Song, T.; Oh, H.-S.; Yang, J.; Yoon, E.; Hong, Songcheol, 2006 IEEE Radio Frequency Integrated Circuits Symposium, pp.37 - 40, IEEE, 2006-06-11

4
Analysis of power distribution network in TSV-based 3D-IC

Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25

5
Analysis on resonator coupling and its application to CMOS quadrature VCO at 8 GHz

Baek, D.; Song, T.; Ko, S.; Yoon, E.; Hong, Songcheol, 2003 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, pp.85 - 88, 2003-06-08

6
Chip-package co-modeling & verification of noise coupling & generation in CMOS DC/DC buck converter

Song, T.; Kim, J.; Pak, J.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.285 - 288, IEEE, 2009-01-12

7
I/O power estimation and analysis of high-speed channels in Through-Silicon Via (TSV)-based 3D IC

Kim, Joungho; Cho, J.; Pak, J.S.; Song, T.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.41 - 44, IEEE, 2010-10-25

8
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer

Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09

9
Modeling and analysis of die-to-die vertical coupling in 3-D IC

Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09

10
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

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