Showing results 1 to 3 of 3
ASSEMBLY OF CAMERA MODULES FOR MOBILE PHONES Choi, Jai Seong; Lee, Kyeng Soo; Lee, Chang Woo; Lee, Houng Chul; Lim, Dong Hyun; Song, Jun Yeob; Kwak, Yoon Keun; et al, Proceedings of 2006 International Symposium on Flexible Automation, pp.432 - 436, ISFA, 2006-07 |
Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching Kim, Kwang-Seok; Lee, Young-Chul; Ahn, Jee-Hyuk; Song, Jun Yeob; Yoo, Choong D.; Jung, Seung-Boo, KOREAN JOURNAL OF METALS AND MATERIALS, v.48, no.11, pp.1028 - 1034, 2010-11 |
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