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On-Chip Canary Circuit Design for Electronic Interconnects by Utilizing RF Resonance Peak Movement as a Prognostic Factor Kang, Tae Yeob; Seo, Donghwan; Kim, Taek-Soo, The 7th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference 2023, IEEE, 2023-03-08 |
Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis Kang, Tae Yeob; Seo, Donghwan; Min, Joonki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.6, pp.990 - 998, 2021-06 |
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