Browse "College of Engineering(공과대학)" by Author Ryu, W
Showing results 1 to 15 of 15
| An Efficient Crosstalk Parameter Extraction of Embedded Microstrip Structures on High-speed MCM Kim, Joungho; Sung, M; Ryu, W; Kim, H; Kim, J, 49th Electronic Components and Technology Conference, pp.0, 49th Electronic Components and Technology Conference, 1999-05 |
| An efficient shared adaptive packet loss concealment scheme through 1-port gateway system for Internet telephony service Kim, J; Lee, H; Ryu, W; Lee, B; Hahn, Minsoo, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E91B, pp.1370 - 1374, 2008-05 |
| Effects of TiO2 nanotube on the electrochemical properties as anode for Li-ion batteries Ryu, W; Kim, R; Han, D; Kim, W; Lim, S; Kwon, Hyuk-Sang, 218th ECS Meeting, pp.1059 -, ECS, 2010-10-10 |
| Embedded microstrip interconnection lines for gigahertz digital circuits Ryu, W; Baik, SH; Kim, H; Kim, J; Sung, MH; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.23, no.3, pp.495 - 503, 2000-08 |
| Enhanced rate capability and cyclic performance of LiMn1.5 Ni0.5O4 by Cl- doping for Li-ion batteries Kim, W; Ryu, W; Han, D; Kim, R; Lim, S; Kwon, Hyuk-Sang, 218th ECS Meeting, pp.1032 -, ECS, 2010-10-10 |
| Improved noise reduction with packet loss recovery based on post-filtering over IP networks Kim, J; Lee, H; Ryu, W; Han, S; Hahn, Minsoo, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E91B, pp.975 - 979, 2008-03 |
| Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
| Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Microwave modeling and characterization of anisotropic conductive adhesive flip-chip interconnection Yim, MJ; Jeon, YD; Paik, Kyung-Wook; Ryu, W; Lee, J; Kim, Joungho, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.35, pp.753 - 758, 1999-12 |
| Noise Reduction for VoIP Speech Codecs Using Modified Wiener Filter Han, S; Jeong, S; Yang, H; Kim, J; Ryu, W; Hahn, Minsoo, Proc. CISSE06, pp.393 - 397, Proc. CISSE06, 2006-10 |
| Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection Kim, N; Sung, M; Kim, H; Baek, S; Ryu, W; An, JG; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.24, no.3, pp.260 - 267, 2001-08 |
| Soft-state bandwidth reservation mechanism for slotted optical burst switching networks Um, TW; Choi, JunKyun; Guo, J; Ryu, W; Lee, BS, ETRI JOURNAL, v.30, pp.216 - 226, 2008-04 |
| Speech Enhancement Using Optimized Wiener Filter for VoIP Speech Codecs Han, S; Jeong, S; Yang, H; Kim, J; Ryu, W; Hahn, Minsoo, Panhellenic Conference in Informatics 2007, pp.445 - 454, PCI, 2007-05 |
| Synthesis of LiFePO4/C cathode by a new two-step microwave process and its electrochemical performances Lim, S; Han, D; Kim, W; Ryu, W; Kwon, Hyuk-Sang, 218th ECS Meeting, pp.1037 -, ECS, 2010-10-10 |
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- 23,036 2020 - 2024
- 75,360 2010 - 2019
- 57,250 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989