Showing results 1 to 5 of 5
An SoC with 1.3 Gtexels/s 3-D graphics full pipeline for consumer applications Kim D.; Park Y.-H.; Seong N.-H.; Lee J.-A.; Park J.; Oh S.; Jeong S.-W.; et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.41, no.1, pp.71 - 84, 2006 |
Fabrication and characterization of glass-ceramic+Al2O3 composition for LTCC(low temperature co-fired ceramic) Lim M.-H.; Park J.-H.; Kim, Ho Gi; Yoo M.-J., Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials, v.2, pp.757 - 760, 2003-06-01 |
Implementation of expert system on estimation of fatigue properties from monotonic mechanical properties including hardness Park J.-H.; Song, Ji Ho; Lee T.; Lee K.-S., 10th International Fatigue Congress, FATIGUE 2010, no.1, pp.1263 - 1272, 2010-06-06 |
Preparation and characterization of BST thin films with hybrid bottom electrodes Ahn J.-H.; Park J.-H.; Lee W.-J.; Kim, Ho Gi, Proceedings of the 1997 MRS Fall Symposium, pp.87 - 92, MRS, 1997-11-30 |
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
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