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Showing results 1 to 5 of 5

1
Apparatus and method for determining source device in contents sharing system

Sung, Dan Keun; Park, Yongsuk; Kim, Sun-Mi; Youn, Chan-Hyun; Kim, Jin-Won; Cha,Ji-Young; Kim, Tae-Hoon; et al

2
Apparatus and method for managing content for cloud computing

Youn, Chan-Hyun; Park, Yongsuk; Kim, Sun-Mi; Sung, Dan Keun; Kim, Jin-Won; Kang, Dong-Ki; Kim, Hee-Jae; et al

3
Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12

4
미세 무연 솔더볼이 계면 반응 및 솔더 조인트 신뢰성에 미치는 영향에 대한 연구 = Studies on the effects of fine size lead-free solder ball on the interfacial reactions and the solder joint reliabilitieslink

박용성; Park, Yong-Sung; et al, 한국과학기술원, 2013

5
주석-은-구리 합금 솔더 조성이 BGA 패키지의 낙하 충격 신뢰성에 미치는 영향 = Effects of Sn-Ag-Cu solder composition on drop test reliability of ball grid array(BGA) packagelink

박용성; Park, Yong-Sung; et al, 한국과학기술원, 2008

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