Browse "College of Engineering(공과대학)" by Author Oppermann, H
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| Multiple Flip-chip Assembly for Hybrid Compact Optoelectronic Modules using Electroplated AuSn Solder Bumps Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, IMAPS 2006 (39th International Symposium on Microelectronics 2006), pp.653 -, 2006 |
| Successive Multiple Flip-chip Assembly using Gold-tin Solder Bump for a Compact Optoelectronic Module Jeon, Duk Young; Chu, KM; Lee, JS; Oppermann, H; Engelmann, G; Wolf, J; Reichl, H, 2006 Microoptics Conference (The Joint International Conference on Plastic Optical Fiber and Microoptics 2006), pp.78 -, 2006 |
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