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Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02 |
Low temperature processing for integrated magnetics Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19 |
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