Browse "College of Engineering(공과대학)" by Author Kyung, Youjin
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| Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics Shin, Sangmyung; Lee, Hanmin; Kim, JunMo; Lee, Tae-Ik; Kim, Taek-Soo; Kyung, Youjin; Jeong, Minsu; et al, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.1146 - 1151, IEEE, 2019-05 |
| Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages Park, Jong-Ho; Lee, Hanmin; Lee, Seyong; Kyung, Youjin; Kim, Jung Hak; Lee, Kwangjoo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.712 - 717, IEEE-CPMT, 2018-05-31 |
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