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Characterization of small-sized eutectic Sn-Bi solder bumps fabricated using electroplating Jung, HR; Kim, HH; Lee, Won-Jong, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.5, pp.1067 - 1073, 2006-05 |
Real-Time Simulation of Interaction between Colon and Endoscope for the Colonoscopy Simulation Jung, HR; Lee Doo Yong, Medicine Meet Virtual Reality 19, pp.218 - 224, MMVR, 2012-02-09 |
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